Embedded Die in Package Patent Investigation Report:Information Technology & Telecommunication Market Research Reports

Information Technology & Telecommunication Market Research Reports

Embedded Die in Package Patent Investigation Report Jul 29th 2013, 00:00, by rnrmahesh Key Features of the Report Statistical analysis of existing IP to give a landscape overview and understand: The evolution of patent families Who are the main players involved in this field In-depth analysis on 10 player portfolios selected by Yole Développement Focus on SEMCO, ASE, Samsung, Unimicron, Intel, Imbera, Shinko, Murata, LG  Innotek, Daeduck: Company profile Patent evolution chart Patent mapping for Embedded IC basic bricks Patent mapping for new architectures In-depth analysis of the main process steps Patent ranking and detailed analysis of the key patents Comparison and matching between existing product process flows (reconstituted from teardowns) and related … Order / Buy a copy of this report @ http://www.rnrmarketresearch.com/contacts/purchase?rname=108789. Complete report details with Table of Contents and more @ http://www.rnrmarketresearch.com/embedded-die-in-package-patent-investigation-report-market-report.html.

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